Introduction
are used for lubrication of semiconductor molding dies, to recover the releasing ability of mold-die surface after cleaning. W80 series rubbers are applied in the same methods as C60 series rubbers. By compression molding, the lubricant can be evenly coated on the surface of the mould cavity .
W80 integrates multiple release agent technology, which can meet the requirements of various types of epoxy molding compounds andprovide continuous and stable release capability through 1 ~ 2 moulding, solidification and wetting.
| Items | Application package | Mold Temperature[℃] | Mold pressure [kgf/cm2] | Optimum cure time [sec] | Recommended Number of shots |
| W80-H | All package | 165～200 | 30～130 | 300～600 | 1～2 |
| W80-U | |||||
| W80-E | LED | 135～165 | 30～130 | 300～600 | 1～2 |
Product Performance
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