Introduction
We develops epoxy molding compounds for BGA/CSP,QFN, and IC cards. The excellent physical and chemical properties of our materials enable semiconductor devices to achieve high reliabilities of MRT, temperature shocking, high temperature, and high current/-voltage, etc.At the same time, Tecore Synchem is also committed to the development of materials with special electrical properties, such ashigh impedance and high dielectric, for advanced el…
High-K Molding Compound for Finger Print Sensor, GT-308
is a non-conductive compound with high dielectric-constant enabling biometric identification. With the well dispersed barium titanate fillers, it enables high dielectric constant up to 15~30 (εr)
and the optimal dielectric loss(tagσ) lower than 1.5%. Through molding process, GT-308 forms a dielectric layer on the surface of integrated capacitive sensor device, permits amplifying capacitive
signals and supports high sensitiveness and resolutions while capacitive sensing operates over a thick protective layer which surpassing 40~100um.
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