Introduction
We develops epoxy molding compounds for BGA/CSP,QFN, and IC cards. The excellent physical and chemical properties of our materials enable semiconductor devices to achieve high reliabilities of MRT, temperature shocking, high temperature, and high current/-voltage, etc.At the same time, Tecore Synchem is also committed to the development of materials with special electrical properties, such ashigh impedance and high dielectric, for advanced electr…
QFN, BGA and CSP Compound, GT-310
is a high-performance green epoxy molding compound specifically developed for BGA and CSP encapsulation.
GT-310 helps the encapsulated BGA and CSP package to achieve the minimum warpage with ultra-low modulus and optimum linear
shrinkage. The high fluidity of GT-310 enables lower wire sweep for fine-pitch package and 0.7mil Au wire or even smaller diameters.
Besides, its excellent adhesion to PCB substrate and silicone chip offers GT-310 high performance during reliability test above
L2@260℃.GT-310 is capable for various of BGA/CSP packages: QFN/DFN,PBGA, LGA, FBGA, CABGA, CTBGA, FCBGA, FC-CSP, etc
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