Integrated LED Chip-Scale Packaging Technology: PFCC TM

PFCCTM (Phosphor Film Coated Chip) doesn’t need reflector, metal lead frame, bonding wire, etc. Instead, it uses B-stage silicone film directly laminated to flip-chip array, curing by compession molding, and sawing into CSP packages, of which size is less than 1.14 times of bare chip. PFCCTM technology can also evolve mini-LED solutions of linear/ surface light sources.

PFCCTM technology resolved color temperature diversity caused by phosphor deposition in silicone glue, improves optical properties and heat dissipation, and saves material cost. The integrated and massive producing of PFCCTM greatly improves manufacturing efficiency and quality conformance, and effectively reduces packaging costs

B-Stage Phosphore Silicone Film TAPITTM

TAPITTM is a B-stage, single-part silicone film, in gelation or solid state at room temperature, which ensures the uniform dispersion of different particle sizes and different types of phosphors without deposition, and fundamentally improves the consistency of colortemperature of LED devices. TAPIT becomes fluidable after heated to 60-80 °C, and forms a package protection structure with certain hardness and strength after cured at 90-150 °C

Dual-Layer Silicone Film for mini LED Backlight: TAPITTM TS-300C + TS-50

is composited by TS-50 phosphor layer and TS-300C transparent layer. It completes the packaging of mini LED backlight module by one-time compression molding. The phosphor film layer encapsulates the chip array comformally and eliminates the color diversity caused by the differenct bonding heights of LED flip chips. The transparent layer works as a pressure-transmission fluid in the process of comformal laminating, and more importantly as a hermetic protective layer for the moisture-sensitive KSF phosphor.

Black Translucent Silicone Film for mini RGB Display: TAPITTM TS-300B
is used for the packaging of mini RGB display modules by vacuum compression molding. TS-300B has excellent adhesion to PCB
substate and very low stress during curing to minize the warpage of substrate. TS-300B has optional types with special optical filler or liner film, to obain AG (anti-glare) or AR (Anti-Reflection) functions.

CSP and Surface-Lights, by TAPITTM TS-300                                             mini RGB Display, by TAPITTM TS-300B